Re tseba ho hlalosa li-chips tse thata, 1-32 layers PCB clone, sebopeho sa PCB, Kopano ea PCB le tlhahiso ea bongata.

Re tsepamisitse maikutlo ho hlahiseng PCBA ea boleng bo holimo, 'me bakeng sa tlhahiso ea batho ba bangata re tla fana ka litheolelo.PCBA kaofela e na le nako ea tiisetso ea selemo se le seng.

Haeba u na le PCB e 'ngoe e kaholimo ho 6, joalo ka 8,10,16 layers,18 layers,28 layers,ka kopo ikopanye le rona, re sebetsa hantle ho kopitsa le ho etsa li-multilayer board. PIC16F1936,PIC16F1947,PIC24FJ64,PIC24HJ64,PIC18F25,EPM240,EPM570,EPM1270,STM,LPC,R5F,MB,NEC,MC,TMS,CY8C,AT91SAM on,TMP le TMP.

 

Bokhoni ba rona ba Prototype ea PCB:

Materia.FR4,High Tg material,CEM1,CEM3

Boto botenya.0.4 ~ 5.0 limilimithara

Palo ea lera.1 ~ 22 layers

Boima ba koporo ho fihla ho 5 Oz

min e qetile lehlakoreng la lesoba: 8 mls

Bophara ba bonyane ba sebaka: 3/3 mls

Solder mask.Botala, Boputsoa, ​​​​Bosoeu, Boso, Boputsoa, ​​​​Bosehla

Legend.Tšweu,Mntsho,Lello

Boholo bo boholo ba boto: 18 * 24 lisenthimithara

Qeta mofuta.1mm Khauta,1mm Silver,1mm Tin,Hard Gold,HASL,LF HASL